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The project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 756049.


Project RocketChip

In the past years, we have witnessed a tipping point for photonics, in several sectors the relatively new technology is growing exponentially. Now the datacom sector realises that the extremely fast growing thirst for Internet bandwidth cannot be easily quenched, big companies such as Google, Facebook and Amazon, are looking for affordable, new technologies.

Nowadays, more and more devices are connected to the internet. IHS forecasts that the Internet of Things (IoT) market will grow from an installed base of 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and 75.4 billion in 2025. All these devices need to make use of the cellular network and in order to provide access, the situation needs to be addressed immediately.

Project “RocketChip” has as main objective the development and production of high-speed, cost-efficient DWDM integrated optics, which are packaged in very compact modules to serve the customer in several potential telecom applications.

The core technology for this high-speed communications module is Photonic Integrated Circuits (PIC). This technology allows the transmit- and receive-functionality of the system to be integrated onto single chips.
The size of the integrated chips will allow the module size to meet the requirement of an industry standard common form factor. This will make it physically compatible with current system vendors’ products. PIC chips are key to the next generation of telecommunications networks that will demand even higher performance, smaller size and lower cost.

Leader in Photonic Integrated Circuits

EFFECT Photonics is one the leaders in the field of Photonic Integrated Circuits (PICs) and will combine its PIC technology (based on technology spun out from Technical University Eindhoven) with its unique and low cost PIC chip packaging technology (15 times cheaper than traditional gold box packaging). This will give EFFECT Photonics a significant cost advantage over competing technologies and products, making it economically viable to manufacture the product in Europe. As Electronic Integrated Circuits have done beforehand, PICs are poised to revolutionise the optical communications landscape.

A sustainable solution to rapidly increasing bandwidth demand

On completion, this project will deliver a key enabler and close to market technology solution for the 400Gb Ethernet (400 GbE) transport, providing a timely solution to the urgent, unrelenting issue of rapidly increasing bandwidth demand, securing Europe’s position at the forefront of an emerging Photonic Integrated Circuit industry. This project will enable EFFECT Photonics to develop a leadership position in the next generation of PICs and hence develop a strong, profitable and growing business in Europe.

  • Aaron Albores-Mejía, Sjoerd van der Heide, Muhammad Usman Sadiq, Saeed Tahvili, Chigo Okonkwo, Boudewijn Docter , “112-Gbit/s/λ PAM4 transmission enabled by a negatively-chirped InP-MZ modulator”, European Conference on Optical Communication (ECOC) , Issue Th.1.C.4., 2017 https://zenodo.org/record/3490598#.XaW6YRFMSUk
  • Sjoerd van der Heide, Aaron Albores-Mejia, Fausto Gomez-Agis, Boudewijn Docter, Chigo Okonkwo, “112-Gbit/s Single side-band PAM-4 transmission over inter-DCI distances without DCF enabled by low-complexity DSP”, European Conference on Optical Communication (ECOC), Issue P2.SC5.8, 2017 https://zenodo.org/record/3490606#.XaW8_BFMSUk
  • Boudewijn Docter, Karen Solis-Trapala, Aaron Albores-Mejia, “InP PIC’s scalability for datacenter applications”, Optical Fiber Communication Conference and Exhibition (OFC) , Issue Th3A.5, 2019 https://zenodo.org/record/3490483#.XaW6uBFMSUk